Language：日本語
ULVAC offers deposition and etching technologies as used in next-generation packaging processes, such as SoC and SiP.
シャッフルカジノ ボーナス Opto-Devices, MEMS
NLD-5700
Production type シャッフルカジノ ボーナスg system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.
Ashing System
シャッフルカジノ 入金不要ボーナスtemsシャッフルカジノ
This ashing system can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
Cluster-type PE-CVD System
Cluster-type PE-シャッフルカジノ
This is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.
シャッフルカジノ ボーナス Production
シャッフルカジノ 入金不要ボーナス
シャッフルカジノ ボーナス high volume production with good cost performance and wide selection of tool configuration.
Cluster-type Sputtrering System
Cluster-typeSputtrering
Highly uniform and stable deposition technology on an 8 inch wafer scale utilizing specially designed sputtering chamber for dielectric materials.
ULVAC unique and stable process allowing high performance PZT thin film in mass production scale under 500degrees.
Multi-chamber Sputtering System
MLXTM-3000N
MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.
Backside Metalization Sputtering System
SRH Series
This is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.
