Language：日本語
ULVAC offers technical solutions for the production of power devices.
ULVAC is the industry leader in the delivery of systems for SiC and Si.
SiC
Si
High-temp シャッフルカジノ 入金不要ボーナスplanter for SiC
IH-860DSIC
IH-860DSIC is high-volume and high temperature system specifically suited for the SiC industry.
Load-lock type シャッフルカジノ 入金不要ボーナス
CS-200
シャッフルカジノ 入金不要ボーナス CS 200 is for research & development and small production application.
Dry Etching System for Production
Multifilm Dry Etching sytem designed for high volume manufacturing. Flexible configuration with low cost of ownership.
Ashing Systems
シャッフルカジノ 入金不要ボーナスtemsシャッフルカジノ
NA series ashing system is a multi-substrate flexible ashing system which can be used for next generation and wafer level packaging processes.
Cluster-type Sputtrering System
SME-200E
Cluster type system which can be used for various types of deposition.(Metal, PZT,BST, AIN, SiNx,AI203)
Supports transfer chamber and various types of depositions.
Batch-type High Vacuum Evaroration System
シャッフルカジノ 入金不要ボーナスh VacuumEvaporation
シャッフルカジノ 入金不要ボーナスeries is a high vacuum evaroration system for the deposition of metal and oxide on a substrate.
Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.
Medium Current シャッフルカジノ 入金不要ボーナスplanter
Medium Current
The SOPHI-260 system is built upon existing medium シャッフルカジノ 入金不要ボーナスplanter technology. However, the system has been designed to reduce cost and still provide a high-quality system with parallel scan capability.
High-energy シャッフルカジノ 入金不要ボーナスplanter
SOPHI-400
SOPHI-400, cluster type high-energy シャッフルカジノ 入金不要ボーナスplanter, has no mass separator and supports thin wafers.
Low-acceleration and High-density シャッフルカジノ 入金不要ボーナスplanter
SOPHI-30
SOPHI-30, low-acceleration and high-density シャッフルカジノ 入金不要ボーナスplanter, is cluster type and supports thin wafers.
Backside Metalization シャッフルカジノ 入金不要ボーナス
SRH Series
SRH Series is a high volume PVD system for the deposition of metallic films required in the power device, WL-CSP, UBM or similar applications.
