ULVAC, Inc. (or "ULVAC", based in Chigasaki, Kanagawa JAPAN; CEO Setsuo Iwashita) today announced to launch "uGmni series", シャッフルカジノ トークンingle-wafer system for thin film deposition and processing. The cluster type system can be equipped with a variety of process modules such as sputtering and etching onto its common transfer core.
As manufacturing of advanced electronics uses a wide variety of processes such as film deposition and fine patterning, commonly, each process uses シャッフルカジノ トークンpecific system designated for such process.
The versatile "uGmni series" platform can equip a variety of process modules, improving efficiency in the manufacturing process. It also utilizes common parts to reduce spare parts, along with using the same operation panels to improve usability.
[Features]
・Able to combine various process chambers: sputtering, etching, ashing and PE-CVD
*Certain combinations may be unavailable depending on the process, so please consult with us.
・All above modules to be manufactured by ULVAC
・Compatible with wafers up to Φ300 ㎜
[Applications]
・Power device: seed and metal layer sputtering
・MEMS sensor: PZT sputtering and etching
・Optical device: VCSEL etching
・Packaging: descum ashing
・Communication device: PE-CVD of insulated film and etching
[Applicable wafer size]
uGmni-200 series MaxΦ200mm
uGmni-300 series MaxΦ300mm
[Transfer core]for Φ200 mm, please inquire for Φ300 mm
Square: maximum 2 process modules
Hexagon: maximum 4 process modules
Heptagon: maximum 5 process modules
[Available process modules]
Sputtering, etching, ashing, PE-CVD and others (manufactured by ULVAC)
uGmni-200, シャッフルカジノ トークンingle-wafer film deposition and etching system for advanced electronics manufacturing
A variety of modules can be equipped, examples below.
*Certain combinations may be unavailable depending on the process, so please consult with us.
uGmni-シャッフルカジノ 評判 single-wafer film deposition シャッフルカジノ 評判rocessing system
ULVAC, Inc. elec_info
Advanced Electronics Equipment Division TEL:+81-467-89-2139
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