シャッフルカジノ トークンext-Generation Semiconductor Packaging Consortium "US-JOINT."

ULVAC, Inc. joined "US-JOINT", a next-generation semiconductor packaging consortium established by Resonac Corporation in Silicon Valley, USA.

US-JOINT is an open consortium designed for end-user collaboration to verify the latest requirements for semiconductor packaging of advanced devices and validate new concepts in development. In addition, by co-creating with customers, シャッフルカジノ トークンsortium will capture market needs in real time, accelerating the R&D of materials and equipment technologies.

Today's rapidly expanding next-generation semiconductors for generative AI and autonomous driving require new approaches to advanced packaging technologies, such as 2.5D and 3D*. Through シャッフルカジノ トークンsortium, ULVAC hopes to contribute its expertise in vacuum technology via its plasma ashing and seed sputtering systems and their process technologies.

*2.5D packaging is a technology to place semiconductor chips in parallel on the interposer. 3D packaging is a technology to laminate chips with TSV (Through Silicon Via).

External Links

About "US-JOINT"

https://www.resonac.com/news/2024/07/08/3116.html

For further information

ULVAC, Inc. elec_info