The International Conference on Semiconductor, シャッフルカジノ ランクアップボーナスtallization Conference 2024, 33rd Asian Session (シャッフルカジノ ランクアップボーナスus 2024), organized by the Japan Society of Applied Physics, will be held at the Takeda Hall, The University of Tokyo, and online from Wednesday, October 3 to Friday, October 4, 2024.
シャッフルカジノ ランクアップボーナスus 2024 is an international conference on interconnect technology for advanced logic and memory devices.
ULVAC will give an invited talk about advanced packaging, titled "Advanced Panel Level Packaging Process Based on Plasma Etching Technology for 3D Chiplets Integration."
| DATE | October 3 - 4, 2024 (JST) |
|---|---|
| LOCATION | Takeda Hall, The University of Tokyo, Japan |
| PRESENTATION DATE | October 4, 2024 |
| TIME | 10:00 - 10:30 (JST) |
| SESSION | Session 7) Advanced Packaging |
| PRESENTATION TITLE | "Advanced Panel Level Packaging Process Based on Plasma Etching Technology for 3D Chiplets Integration" |
External Links
https://www.admeta.org/en/index-en?p_year=2024
https://www.admeta.org/en/cpt_admeta/program-2024-en
For further information
ULVAC, Inc. web_info
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