ISMP-IRSP 2024 will be held at Paradise Hotel Busan, Korea, from November 5 (Tue.) to November 8 (Fri.), 2024.
The ISMP, organized by KMEPS (The Korean Microelectronics and Packaging Society), presents a valuable opportunity to share the latest electronic packaging technologies. Meanwhile, the IRSP discusses the coupled electro-thermal-mechanical complexities in materials, devices, circuits, and package-systems that crucially affect the design and technology of electronics.
ULVAC, Inc. will give an invited talk on "Polymer Fine Via Formation Based upon Plasma Etching Technology for 3D Chiplet Integration" at ISMP-IRSP 2024.
| DATE | November 5 (Tue.) - November 8 (Fri.), 2024 (KST) |
|---|---|
| LOCATION | Paradise Hotel Busan, Korea |
| PRESENTATION DATE | November 7, 2024 |
| TIME | 15:20 - 15:45 (KST) |
| SESSION | ICEP session |
| PRESENTATION TITLE | Invited 2-21 " Polymer Fine Via Formation Based upon Plasma Etching Technology for 3D Chiplet Integration" |
External Links
https://www.ismp.or.kr/html/?pmode=glance
https://www.ismp.or.kr/html/?pmode=speakers
For further information
ULVAC, Inc. web_info
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