シャッフルカジノ 入金方法s are produced by the Gas Evaporation Method. These newly developed inks consist of metal nanoparticles dispersed stably and not aggregated in some organic solvent. The inks enable to form electro-conductive fine patterns directly by printing processes such as ink-jet printing.
Ag シャッフルカジノ 入金方法 enables to form Ag films at the curing temperature of 230℃.
Ag シャッフルカジノ 入金方法 (Solvent: Toluene)
Ag シャッフルカジノ 入金方法 (Solvent: Tetradecane) Ink-jet Type
TEM image of Ag nanoparticles dispersed in Ag シャッフルカジノ 入金方法 Average particle size is 7.8nm
■Particle size distribution of Ag シャッフルカジノ 入金方法
■Electric resistivity vs. curing temperature of Ag シャッフルカジノ 入金方法 films
■Viscosity vs. temperature of Ag シャッフルカジノ 入金方法
Product Name | Au シャッフルカジノ 入金方法 | Ag シャッフルカジノ 入金方法 |
Ag シャッフルカジノ 入金方法 |
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Grade | Au1T | Au1Chb | Ag1T | Ag1TeH | L-Ag1T | L-Ag1TeH |
For Ink-Jet | X | ○ | X | ○ | X | ○ |
Metal concentration(wt%) | 30 | 50-60 | 30 | 50-60 | 30 | 50-60 |
Solvent | Toluene | Cyclohexylbenzene | Toluene | Tetradecane | Toluene | Tetradecane |
Average Particle Size (nm) |
3-8 | 3-8 | 3-8 | |||
Viscocity (mPa・s) | <5 | 5-15 | <5 | 5-15 | <5 | 5-15 |
Coating characteristic | ||||||
Curing Condition | 250℃×60min (in Air) | 230℃×60min (in Air) | 150℃×60min (in Air) | |||
Thickness(μm) | <1 | <1 | <1 | |||
Resistivity (μΩ・cm) | approx.8 | approx.20 | approx.3 | approx.10 | ||
Substrate to be used |
Heat-resistant temperature of substrates should be higher than sintering temperature. (example:polyimide, glass, metal, ceramic etc.) |
Specifications are subject to change.
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