シャッフルカジノ ログインatureCuring Silver Ink,”L-Ag”Series
Materials
Nano-metal Ink

シャッフルカジノ ログインature
Curing Silver Ink,
”L-Ag”Series

シャッフルカジノ ログイン
シャッフルカジノ ログイン

シャッフルカジノ ログインs are produced by the Gas Evaporation Method. These newly developed inks consist of metal nanoparticles dispersed stably and not aggregated in some organic solvent. The inks enable to form electro-conductive fine patterns directly by printing processes such as ink-jet printing.

シャッフルカジノ ログイン
シャッフルカジノ ログイン

Curing temperature as low as 150°C
L-Ag シャッフルカジノ ログイン (Solvent: Toluene)
L-Ag シャッフルカジノ ログイン (Solvent: Tetradecane) Ink-jet Type

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TEM image of シャッフルカジノ ログインoparticles dispersed in L-Ag シャッフルカジノ ログイン Average particle size is 2.6nm

■Particle size distribution of L-Ag NANOMETAL INK(シャッフルカジノ ログインature type)

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Electric resistivity vs. curing temperature of L-Ag シャッフルカジノ ログイン films

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■Ag electronic circuit pattern formed by ink-jet printing on PET

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シャッフルカジノ ログイン

Product Name Au シャッフルカジノ ログイン Ag シャッフルカジノ ログイン

Ag シャッフルカジノ ログイン
(シャッフルカジノ ログインature type)

Grade Au1T Au1Chb Ag1T Ag1TeH L-Ag1T L-Ag1TeH
For Ink-Jet X X X
Metal concentration(wt%) 30 50-60 30 50-60 30 50-60
Solvent Toluene Cyclohexylbenzene Toluene Tetradecane Toluene Tetradecane
Average Particle
Size (nm)
3-8 3-8 3-8
Viscocity (mPa・s) <5 5-15 <5 5-15 <5 5-15
Coating characteristic
Curing Condition 250℃×60min (in Air) 230℃×60min (in Air) 150℃×60min (in Air)
Thickness(μm) <1 <1 <1
Resistivity (μΩ・cm) approx.8 approx.20 approx.3 approx.10
Substrate to be used

Heat-resistant temperature of substrates should be higher than sintering temperature.

(example:polyimide, glass, metal, ceramic etc.)

Specifications are subject to change.

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