シャッフルカジノ urnaceH Series
Thermal Processing System

シャッフルカジノurnaceH Series

シャッフルカジノ

Highly reliable thermal processing system with over thirty years of experience.It can be used for heat treatment such as oxidation, diffusion, シャッフルカジノling of 200mm silicon wafers.

シャッフルカジノ

Features

  • シャッフルカジノurnace used as oxidation furnace, diffusion furnace, and annealing furnace
  • Selectable from 3 types of models according to processing volume.
  • Run different processes with one device.
    Three or four tubes configuration save space.
  • 5 zone heaters are respectively independent, so it is possible to controll with excellent temperature uniformity and stability.
  • Original control system dedicates easy and reliable operation.
  • Regarding シャッフルカジノ3-125 and シャッフルカジノ4-125, it is easy to load on the top of tube because they have boat elevator as standard.
  • Pyrogenic wet oxide, wet oxide, dry oxide, Phosphorus and Boron doping with POCl3 or BBr3, シャッフルカジノal.

Applications

  • Thermal oxidation, diffusion, シャッフルカジノal for silicon wafer.

Specifications

Model シャッフルカジノ3-50 シャッフルカジノ3-125 シャッフルカジノ4-125
Process Oxidation, diffusion, anneal
Wafer size ~200mm (8 inch)
Number of tube 3 3 4
Product load 50 125 125
Temp. control zone 5
Heater material Fe-Cr-Al
Operation Temp(℃) 600~1200
Soaking zone(mm) 370 800 800
Temp. uniformity(℃) ±1.0

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